Scanning Acoustic Microscope (SAM)
The KSI WINSAM Vario III scanning acoustic microscopy (SAM) is a powerful, non-destructive technique that can detect hidden defects in elastic and non-transparent hard materials. SAM uses point focusing technology, which relies on a beam to scan and penetrate the specimen while it is in water. Scanning each point individually with a wavelength of less than one, SAM eliminates opportunities for interference and then creates the overall image by bringing together those obtained from each point. By monitoring the internal features of a sample in three-dimensional integration, this technique can efficiently find physical defects such as cracks, voids, and delamination with high sensitivity.
Typical Applications:
- Counterfeit detection, product reliability testing, and failure analysis of semiconductor devices
- Inspection of solder pads, flip-chip, underfill, die-attach
- Inclusions, heterogeneities, porosities, cracks in material
- Sub-micron features, such as popcorn cracking and die attach voiding, both of which a typical x-ray would not be able to detect
- Depth of internal layers, check ceramic direct bond for delamination and maintain sample quality of hermetically sealed items, while also evaluating the purity of flip chip underfill
- Detecting discontinuities in silicon in semiconductor devices
Specifications:
- Ultrasonic generator bandwidth: 5 ~ 500MHz
- Scanning range: 0.25 x 0.25mm ~ 300 x 300mm
- Frequency range: 1 ~ 500MHz
- Transducer selection: 5 ~ 400MHz
- Scanning mechanism resolution: 0.1µm
- Scan mode: A,B,C,D,G,X,3D
- Minimum threshold time: 1ns