Scanning Acoustic Microscope (SAM)

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The KSI WINSAM Vario III scanning acoustic microscopy (SAM) is a powerful, non-destructive technique that can detect hidden defects in elastic and non-transparent hard materials. SAM uses point focusing technology, which relies on a beam to scan and penetrate the specimen while it is in water. Scanning each point individually with a wavelength of less than one, SAM eliminates opportunities for interference and then creates the overall image by bringing together those obtained from each point. By monitoring the internal features of a sample in three-dimensional integration, this technique can efficiently find physical defects such as cracks, voids, and delamination with high sensitivity.

Typical Applications:

  • Counterfeit detection, product reliability testing, and failure analysis of semiconductor devices
  • Inspection of solder pads, flip-chip, underfill, die-attach
  • Inclusions, heterogeneities, porosities, cracks in material
  • Sub-micron features, such as popcorn cracking and die attach voiding, both of which a typical x-ray would not be able to detect
  • Depth of internal layers, check ceramic direct bond for delamination and maintain sample quality of hermetically sealed items, while also evaluating the purity of flip chip underfill
  • Detecting discontinuities in silicon in semiconductor devices


  • Ultrasonic generator bandwidth: 5 ~ 500MHz
  • Scanning range: 0.25 x 0.25mm ~ 300 x 300mm
  • Frequency range: 1 ~ 500MHz
  • Transducer selection: 5 ~ 400MHz
  • Scanning mechanism resolution: 0.1µm
  • Scan mode: A,B,C,D,G,X,3D
  • Minimum threshold time: 1ns
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