Artificial Intelligence - Transforming Products and Impacting Safety & Reliability

Wednesday (12/06) was the HKSTPxArrow Hardware Lab Innovation Day, for the celebration of the first year of collaborative achievements between the HKSTP and Arrow Electronics, and an opportunity to explore the latest in Microelectronics and Electronics Engineering technology with a variety of exhibitors at the Hong Kong Science Park.

CAiRS Recorded a Remarkable Achievement for the first time at International Exhibition of Inventions Geneva 2024. Winning 12 awards including 3 gold with a Prize of the International Federation of Inventors’ Association (IFIA)

(Hong Kong, 28 September2023) – Hong Kong Science and Technology Parks Corporation (HKSTP) signed a partnership agreement with the Centre for Advances in Reliability and Safety (CAiRS), an InnoHK Centre established by The Hong Kong Polytechnic University (PolyU) and The University of Maryland, College Park from USA, to provide vital testing and pilot-at-scale capabilities to microelectronics (micro-e) and advanced manufacturing startups.

Inauguration of IEEE Reliability Society, Hong Kong Chapter cum HKSTP x CAiRS Collaboration Agreement Signing Ceremony